Alrighty, what specs did LG provide for a budget phone like this in 2014?

4.7" 960x540 display at 234ppi

Quad-core, 1.2 GHz Snapdragon 400 processor and 450 MHz Adreno 305 GPU

1 GB RAM

8 MP/1080p rear camera with autofocus, and 0.3 MP front-facing camera

3G wireless support, 802.11 b/g/n (2.4GHz) Wi-Fi 4, and Bluetooth 4.0

8 GB built-in memory

Android 4.4.2 KitKat, up to Android 5.0.2 Lollipop

Those specs were quite fine for that time. This phone even had enough storage to download basic apps, unlike its smaller brother, LG Optimus L70. I mean, come on, it had only 1.5 GB available out of given 4 GB for apps, and two thirds of that space were already taken by preloaded apps! That is quite harsh.

Anyways. The plastic back cover is held by plastic clips and is easy to remove. Underneath it lies a LG's 3.8V 2540mAh BL-54SH battery.

And it still has a warning icon, indicating that it's unsafe to let pets smaller than this battery anywhere near it. Just like its bigger and beefier brother.

Time to pull out the PH00 screwdriver! The midframe is held by eleven 4mm screws. For some reason, my unit lacks one screw. Did somebody steal it while I was sleeping?

But we're not done here yet, as the midframe is also held by plastic clips. Time to break it off with a spudger!

As I'm flipping the midframe, we can see some antennas, a vibration motor and a speaker. Nothing interesting here, sadly.

We're getting closer to that yummy teal bowl that's full of chips now! Time to unplug the flex cables.

Time to take a small look at the cameras. Look how tiny the 0.3 MP front camera looks compared to the 8 MP rear camera!

And don't forget about the headphone jack and the earpiece speaker! Just like the camera modules, they're modular and easy to pop off.

Time for the grand reveal! The front side doesn't have any interesting chips.

However, if we flip the motherboard and take the EMI shield off, we can finally take a look at these beautiful silicon chips!

SK Hynix H9TKNNN8JDAPLR-NGH 1GB LPDDR2-1066 RAM

The Quad-core, 1.2 GHz Snapdragon 400 SoC is layered beneath the RAM

Samsung KLM8G1WEMB-8031 8 GB eMMC 5.0 NAND flash

Skyworks SKY77573-31 Tx-Rx Front-end Module for GSM/GPRS/EDGE

Atmel mXT336S-AT

Qualcomm PM8226 power management IC

Because of that obnoxious camera zoom, I wasn't able to identify other chips. Maybe I should buy a proper camera instead of shooting everything on my Pixel...

The daughterboard, on the other hand, doesn't have anything interesting on it. Just some regular stuff that you'll see on other daughterboards.

Micro-USB 2.0 port

Vibration motor spring contacts

Speaker spring contacts

Coax connector

Microphone

I decided not to take this phone down even further. But believe me, if you'll look for screen replacement guides, you'll find out that the IPS panel and the touchscreen aren't fused!

I'm pretty sure that if iFixit team decided to tear this phone down back then, it'd definitely score 10 out of 10. This phone is as modular as the latest Fairphone 6!