Introdução
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Use a Torx Plus 3IP driver to remove the two 2.8 mm‑long screws securing the interconnect cable bracket.
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Use the point of a spudger to pry up and disconnect the interconnect cable press connectors.
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Use a Torx Plus 3IP driver to remove the 2.8 mm‑long screw securing the inner display connector bracket.
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Use the point of a spudger to pry up the inner screen connector bracket and release its plastic clip from the left edge of the frame.
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Pull the inner display connector bracket towards the left edge of the phone to release its metal clip.
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Use tweezers, or your fingers, to peel off the yellow tape on the side button cable ZIF connector.
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Use the point of a spudger, or your fingernail, to lift the locking tab on the side button cable ZIF connector.
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Insert a spudger under the top edge of the logic board, next to the 5G mmWave antenna cutout.
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Pry up the logic board enough so you can grip the top edge with your fingers.
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Lift the top of the logic board slowly until the clips at the bottom edge of the logic board release.
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Slide the logic board out of the USB-C port cutout and remove it.
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Use the flat end of a spudger to scrape off all of the thermal paste from the frame.
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Apply isopropyl alcohol (>90%) and use a coffee filter or microfiber cloth to clean any thermal paste residue.
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To reassemble your device, follow these instructions in reverse order.